Industry Scenarios
Use three process chains to explore possible tool integration points, validation tasks, and applicability boundaries
1. Display Panels
Scenario-based solution
❌ Core Challenge
Substrate identity and carrier binding break easily; alignment-exposure and colour-filter pattern defects rely on manual re-inspection; Cell/Module anomalies are hard to trace back to a specific step.
🧭 openIndu Reference Collaboration
🖥️ Hardware Execution Layer
A soft PLC on domestic industrial silicon drives loading, cleaning and lamination takt, with anti-collision interlocks on the robot arms.
👁️ Machine Vision Inspection
openIndu-vision uses OpenCV for surface particles/scratches, pattern breaks and pinholes, and lit-panel appearance judgement.
📊 Data Acquisition & Analysis
Assess whether openIndu-cim + openIndu-platform can associate Glass ID, carrier ID, process route, and program versions.
📚 Craftsmanship Knowledge Base
The forum's panel column collects field practice and defect back-tracing for the TFT-LCD / OLED chains.
🔗 End-to-End Process Chain
Why it works: A target architecture can connect engineering assets, inspection results, and step identity. Cross-brand generation, control-loop latency, and end-to-end traceability still require validation in the target environment.
2. Semiconductors
Scenario-based solution
❌ Core Challenge
Wafer identity and route-admission checks are scattered across tools; recipe versions and SPC rules are hard to unify; defect maps cannot effectively drive back-end sorting.
🧭 openIndu Reference Collaboration
🖥️ Hardware Execution Layer
Domestic industrial silicon handles transport and tool interlocking, gating admission on prerequisites and SPC rules.
👁️ Machine Vision Inspection
openIndu-vision joins appearance and defect re-inspection, emitting coordinates and layer information.
📊 Data Acquisition & Analysis
Assess openIndu-cim for edge-side processing and openIndu-platform for associating wafer ID, FOUP, recipe versions, and metrology values.
📚 Craftsmanship Knowledge Base
The forum's semiconductor column records interface conventions and traceability fields for the wafer-to-package chain.
🔗 End-to-End Process Chain
Why it works: The scenario can verify whether decision data, edge processing, and chamber or lot traceability form a reproducible path.
3. New Energy
Scenario-based solution
❌ Core Challenge
Material-lot identity is hard to guarantee before mixing; cell identity easily decouples from formation and grading curves; EOL data in the module/PACK stage is incomplete.
🧭 openIndu Reference Collaboration
🖥️ Hardware Execution Layer
Domestic industrial silicon controls coating, assembly and formation-cabinet takt, coordinating multi-brand equipment.
👁️ Machine Vision Inspection
openIndu-vision inspects electrode alignment, weld spots and module appearance (including PV EL images).
📊 Data Acquisition & Analysis
Assess whether openIndu-cim + openIndu-platform can associate material lots, cell identity, test curves, PACK, and EOL records.
📚 Craftsmanship Knowledge Base
The forum's new-energy column records process parameters and anomaly handling for the lithium-battery and PV-module chains.
🔗 End-to-End Process Chain
Why it works: The scenario helps define validation points for identity continuity and curve association. Lithium-battery and PV workflows must be evaluated separately.
How openIndu Directions Support Scenario Assessment
The project map helps identify interfaces among vision, control, engineering assets, and data. Actual capability depends on repository status and reproducible evidence.
Cross-brand engineering asset exploration
Mappings and intermediate artifacts can reduce repeated entry; every brand, version, and output format still requires validation in the target IDE and hardware environment.
Vision-control interface assessment
Use openIndu-vision and openIndu-studio to explore inspection-result interfaces. Control-loop behaviour and latency require target-system tests.
Parameter delivery and audit
Use openIndu-platform to explore permissions, versions, effective-time mechanisms, and rollback. Delivery latency must be measured in the target environment.
Data-path validation
Map the intended path across equipment, vision, parameters, and process knowledge, then verify each interface. An architecture diagram is not a production data path.
Process knowledge discussion
The forum preserves context, constraints, validation steps, and applicability boundaries. Parameters cannot be reused outside their material, equipment, and test conditions.
Built for engineering collaboration
Review each repository's status, LICENSE, dependencies, deployment notes, and limitations before adoption or extension.
Next Steps
Find your industry
Pick the scenario above that is closest to your line
Explore the architecture
Review the project map, current status, capability boundaries, and available evidence
Start building
Review openIndu-studio repository status, documentation, and reproducible examples